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M04000 - SEMI M40 - シリコンウェーハ表面のラフネス測定のガイド Revision:SEMI M40-1109 - Superseded These defects may consist of

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Description

These defects may consist of impurity elements as well as structural defects within grains such as dislocations and dislocation networks

本スタンダードは,global Silicon Wafer Committeeで技術的に承認されている。現版は2010年12月21日,global Audits and Reviews Subcommitteeにて発行が承認された。2011年2月にwww

and JIS G 4318

SEMI E57 — Mechanical Specification for Kinematic Couplings Used to Align and Support 300 mm Wafer Carriers

SEMI F45-0307 (Reapproved 0818)

M04000 - SEMI M40 - シリコンウェーハ表面のラフネス測定のガイド Revision:SEMI M40-1109 - Superseded These defects may consist ofglobal Silicon Wafer Committee200994global Audits and Reviews Subcommittee200910www. semi. org200911CD ROM20002 SEMI M1 3 Referenced SEMI Standards SEMI E89 Guide for Measurement System Analysis (MSA) SEMI M1 Specifications for Polished Single Crystal Silicon Wafers SEMI M20 Practice for Establishing a Wafer Coordinate System SEMI M50 Test Method for Determining Capture Rate and False Count Rate

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